Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist

C. M. Tan, K. P. Lim, T. C. Chai, and J. Lim. “Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist,” Microelectronics Reliability, vol. 45, no. 9-11, pp. 1572-1575, 2005
https://www.sciencedirect.com/science/article/pii/S002627140500199X