刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming Monte Carlo simulation of fatigue crack initiation at elevated temperature F. He and C. M. Tan, “Monte Carlo simulation of fatigue crack initiation at elevated temperature,” in 13th Int. Conf. on Fracture, Beijing, China, 16th-21st Jun. 2013.
期刊 Journal Paper Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Overcoming intrinsic weakness of ULSI metallization electromigration performances Bya0938724577 2004 年 2 月 25 日2021 年 3 月 4 日
期刊 Journal Paper | 陳始明 Dr. Tan, Cher Ming The difference between reliability engineering and reliability science ByJames 2021 年 2 月 20 日2021 年 4 月 12 日
期刊 Journal Paper Low temperature sol-gel intermediate layer wafer bonding Bya0938724577 2006 年 2 月 25 日
期刊 Journal Paper | 高瑄苓 Dr. Kao,Hsuan-Ling Channel modification engineering by plasma processing in tin-oxide thin film transistor: experimental results and first-principles calculation ByJames 2017 年 4 月 1 日2021 年 4 月 13 日
期刊 Journal Paper | 陳始明 Dr. Tan, Cher Ming Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder Byidiotj2002dm 2010 年 2 月 1 日2021 年 4 月 12 日