C. M. Tan, U. Narula, G. L. Seow, V. Sangwan, C. H. Chen, S. P. Lin, and J. Y. Chen, “Moisture Resistance Evaluation on Single Electronic Package Moulding Compound”, Journal of Materials Chemistry C, 2020, DOI:10.1039/C9TC04298A
Moisture resistance evaluation on single electronic package moulding compound – Journal of Materials Chemistry C (RSC Publishing) DOI:10.1039/C9TC04298A