Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief

K. Ghosh*, J. Zhang, L. Zhang, Y. Dong, H. Li, C. M. Tan, G. Xia, and C. S. Tan, “Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief,” Applied Physics Express, vol. 5(12), pp. 126601-3, December, 2012.
https://iopscience.iop.org/article/10.1143/APEX.5.126601/pdf