Indentation size effect on the hardness of a Sn-Ag-Cu Solder
Y. D. Han, S. M. L Nai, Y. C. Liu, C. M. Tan, and J. Wei. “Indentation size effect on the hardness of a Sn-Ag-Cu Solder,” in Int. Mechanical Engineering Congress and Exposition, 2009.
Y. D. Han, S. M. L Nai, Y. C. Liu, C. M. Tan, and J. Wei. “Indentation size effect on the hardness of a Sn-Ag-Cu Solder,” in Int. Mechanical Engineering Congress and Exposition, 2009.