Indentation size effect on the creep behavior of a Sn-Ag-Cu solder

Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L.Y. Xu. “Indentation size effect on the creep behavior of a Sn-Ag-Cu solder,” in Int. Conf. on Materials for Advanced Technologies, 2009.