Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits

Dipesh Kapoor, Cher Ming Tan, and Vivek Sangwan, “Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits”, Applied Sciences 10, no. 3, pp. 748, 2020
https://www.mdpi.com/2076-3417/10/3/748/htm