Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes

S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei. “Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes,” in Int. Conf. on Electronic Packaging Technology & High Density Packaging, China, 2009, pp. 540-543.