Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects

C. M. Tan, A. Roy, K. T. Tan, D. Sim, K. Ye, and F. Low. “Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects,” Microelectronics Reliability, vol. 45, no. 9-11, pp. 1449-1454, 2005
https://www.sciencedirect.com/science/article/pii/S0026271405001952