Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures

A. Roy, C. M. Tan, R. Kumar, and X. T. Chen. “Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.