Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification

M. X. Gu, T. C. A. Yeung, V. Nosik, and C. M. Tan. “Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification,” Journal of Applied Physics, vol. 100, pp. 94304, 2006
https://aip.scitation.org/doi/full/10.1063/1.2364580