A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) 期刊 Journal Paper A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) 閱讀全文 »
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 閱讀全文 »
Analysis of electromigration test data 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Analysis of electromigration test data 閱讀全文 »
Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures 閱讀全文 »
Metastability in tritiated amorphous silicon 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Metastability in tritiated amorphous silicon 閱讀全文 »
Backside copper contamination issues in CMOS integrated circuits 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Backside copper contamination issues in CMOS integrated circuits 閱讀全文 »
Microelectronic Yield, Reliability, and Advanced Packaging 著作 Book Microelectronic Yield, Reliability, and Advanced Packaging 閱讀全文 »
Reliability data analysis software development 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability data analysis software development 閱讀全文 »
A new quality control parameter in wafer fabrication for wire bonding integrity 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A new quality control parameter in wafer fabrication for wire bonding integrity 閱讀全文 »
Integrating device modeling in QFD implementation for power electronics applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Integrating device modeling in QFD implementation for power electronics applications 閱讀全文 »