A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs 閱讀全文 »
A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry 閱讀全文 »
A cost model for the predictive maintenance policy of a multi-state system 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A cost model for the predictive maintenance policy of a multi-state system 閱讀全文 »
Predictive maintenance and its impact to business decision (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Predictive maintenance and its impact to business decision (invited) 閱讀全文 »
Maintenance policy for predictive maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Maintenance policy for predictive maintenance (invited) 閱讀全文 »
Investigation of weight-on-wheel switch failure in F-16 aircraft 期刊 Journal Paper Investigation of weight-on-wheel switch failure in F-16 aircraft 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 期刊 Journal Paper Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
Mathematical model for low-temperature wafer bonding under medium vacuum and its application 期刊 Journal Paper Mathematical model for low-temperature wafer bonding under medium vacuum and its application 閱讀全文 »
Reliability screening through electrical testing for press-fit alternator power diode in automotive application 期刊 Journal Paper Reliability screening through electrical testing for press-fit alternator power diode in automotive application 閱讀全文 »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 期刊 Journal Paper Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 閱讀全文 »
