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An approach to statistical analysis of gate oxide breakdown mechanisms 期刊 Journal Paper An approach to statistical analysis of gate oxide breakdown mechanisms 閱讀全文 »
Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures 期刊 Journal Paper Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures 閱讀全文 »
Aligned carbon nanotubes for through-wafer interconnects 期刊 Journal Paper Aligned carbon nanotubes for through-wafer interconnects 閱讀全文 »
Room temperature observation of point defect on gold surface using thermovoltage mapping 期刊 Journal Paper Room temperature observation of point defect on gold surface using thermovoltage mapping 閱讀全文 »
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Application of Gamma Distribution in Electromigration for Submicron Interconnects 期刊 Journal Paper Application of Gamma Distribution in Electromigration for Submicron Interconnects 閱讀全文 »
Lifetime modeling for stress-induced voiding in integrated circuit interconnections 期刊 Journal Paper Lifetime modeling for stress-induced voiding in integrated circuit interconnections 閱讀全文 »
Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab 期刊 Journal Paper Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab 閱讀全文 »
