Contamination Assessment of Inductive Couple Plasma Etching Chamber under Mixture of Recipes using Statistical Method 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Contamination Assessment of Inductive Couple Plasma Etching Chamber under Mixture of Recipes using Statistical Method 閱讀全文 »
On-chip RF energy harvesting circuit for image sensor 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming On-chip RF energy harvesting circuit for image sensor 閱讀全文 »
Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy 閱讀全文 »
FTIR spectroscopy as a tool for nano-material characterization 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming FTIR spectroscopy as a tool for nano-material characterization 閱讀全文 »
Humidity study of a-Si PV cell 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Humidity study of a-Si PV cell 閱讀全文 »
Circuit level interconnect reliability study using 3D circuit model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Circuit level interconnect reliability study using 3D circuit model 閱讀全文 »
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 閱讀全文 »
Hot carrier reliability of power SOI EDNMOS 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Hot carrier reliability of power SOI EDNMOS 閱讀全文 »
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 閱讀全文 »
Addressing the challenges in solder resistance measurement for electromigration test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Addressing the challenges in solder resistance measurement for electromigration test 閱讀全文 »
