Reliability Evaluation and Improvement for High Power LED Driver 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability Evaluation and Improvement for High Power LED Driver 閱讀全文 »
ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device 閱讀全文 »
Monte Carlo simulation of fatigue crack initiation at elevated temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Monte Carlo simulation of fatigue crack initiation at elevated temperature 閱讀全文 »
Systematic root cause analysis for GaP green light LED degradation 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Systematic root cause analysis for GaP green light LED degradation 閱讀全文 »
Electromigration Modeling at Circuit Layout Level 著作 Book Electromigration Modeling at Circuit Layout Level 閱讀全文 »
Optimal maintenance strategy of deteriorating system under imperfect maintenance & inspection using mixed inspection scheduling 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Optimal maintenance strategy of deteriorating system under imperfect maintenance & inspection using mixed inspection scheduling 閱讀全文 »
Investigation of work function and surface energy of aluminum – an AB-Initio study 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Investigation of work function and surface energy of aluminum – an AB-Initio study 閱讀全文 »
Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for ultra high power light-emitting diode 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for ultra high power light-emitting diode 閱讀全文 »
Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling 閱讀全文 »
Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief 閱讀全文 »
