Investigation of weight-on-wheel switch failure in F-16 aircraft 期刊 Journal Paper Investigation of weight-on-wheel switch failure in F-16 aircraft 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 期刊 Journal Paper Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
Mathematical model for low-temperature wafer bonding under medium vacuum and its application 期刊 Journal Paper Mathematical model for low-temperature wafer bonding under medium vacuum and its application 閱讀全文 »
Reliability screening through electrical testing for press-fit alternator power diode in automotive application 期刊 Journal Paper Reliability screening through electrical testing for press-fit alternator power diode in automotive application 閱讀全文 »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 期刊 Journal Paper Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 閱讀全文 »
Temperature dependence of the field emission of multiwalled carbon nanotubes 期刊 Journal Paper Temperature dependence of the field emission of multiwalled carbon nanotubes 閱讀全文 »
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects 期刊 Journal Paper Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects 閱讀全文 »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures 期刊 Journal Paper Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures 閱讀全文 »
Current crowding effect on copper dual damascene via bottom failure for ULSI applications 期刊 Journal Paper Current crowding effect on copper dual damascene via bottom failure for ULSI applications 閱讀全文 »
Effect of medium vacuum on low temperature wafer bonding 期刊 Journal Paper Effect of medium vacuum on low temperature wafer bonding 閱讀全文 »
