Reliability study of LED driver – a case study of black box testing 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Reliability study of LED driver – a case study of black box testing 閱讀全文 »
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints 閱讀全文 »
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test 閱讀全文 »
Effect of IC layout on the reliability of CMOS amplifiers 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of IC layout on the reliability of CMOS amplifiers 閱讀全文 »
Applications of Finite element Methods for Reliability Study of ULSI Interconnections 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Applications of Finite element Methods for Reliability Study of ULSI Interconnections 閱讀全文 »
ICMAT 2011 – Reliability and variability of semiconductor devices and ICs 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming ICMAT 2011 – Reliability and variability of semiconductor devices and ICs 閱讀全文 »
Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes 閱讀全文 »
Rapid light output degradation of GaN based packaged LED in the early stage of humidity test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Rapid light output degradation of GaN based packaged LED in the early stage of humidity test 閱讀全文 »
Applications of multi-walled carbon nanotube in electronic packaging 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Applications of multi-walled carbon nanotube in electronic packaging 閱讀全文 »
Electromigration reliability of interconnections in RF low noise amplifier circuit 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration reliability of interconnections in RF low noise amplifier circuit 閱讀全文 »