The difference between reliability engineering and reliability science 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming The difference between reliability engineering and reliability science 閱讀全文 »
Advanced interface materials 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Advanced interface materials 閱讀全文 »
In-situ Characterization of the Defect Density in Reduced Graphene Oxide under Electrical Stress Using Fluorescence Microscopy 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming In-situ Characterization of the Defect Density in Reduced Graphene Oxide under Electrical Stress Using Fluorescence Microscopy 閱讀全文 »
Multi-Criteria decision making (MCDM) for the selection of Li-Ion batteries used in electric vehicles (EVs) 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Multi-Criteria decision making (MCDM) for the selection of Li-Ion batteries used in electric vehicles (EVs) 閱讀全文 »
Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier 閱讀全文 »
Analytical modeling electrical conduction in resistive-switching memory through current-limiting-friendly combination frameworks 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Analytical modeling electrical conduction in resistive-switching memory through current-limiting-friendly combination frameworks 閱讀全文 »
Accurate Real Time On-Line Estimation of State-of-Health and Remaining Useful Life of Li ion Batteries. 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Accurate Real Time On-Line Estimation of State-of-Health and Remaining Useful Life of Li ion Batteries. 閱讀全文 »
Optimization of a T-Shaped MIMO Antenna for Reduction of EMI. 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Optimization of a T-Shaped MIMO Antenna for Reduction of EMI. 閱讀全文 »
Moisture Resistance Evaluation on Single Electronic Package Moulding Compound 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Moisture Resistance Evaluation on Single Electronic Package Moulding Compound 閱讀全文 »
Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits 閱讀全文 »
