Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites 閱讀全文 »
Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects 閱讀全文 »
Electromigration in width transition copper interconnect 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration in width transition copper interconnect 閱讀全文 »
Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials 閱讀全文 »
Review of electromigration modeling of IC Interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Review of electromigration modeling of IC Interconnects 閱讀全文 »
A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints 閱讀全文 »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 閱讀全文 »
Local bond average for the size and temperature dependence of elastic and vibronic properties of nanostructures 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Local bond average for the size and temperature dependence of elastic and vibronic properties of nanostructures 閱讀全文 »
Solubility, dispersion and bonding of functionalised carbon nanotubes in epoxy resins 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Solubility, dispersion and bonding of functionalised carbon nanotubes in epoxy resins 閱讀全文 »
