Comparison of SOI and PSOI LDMOS using electrical-thermal-stress coupled field modeling 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Comparison of SOI and PSOI LDMOS using electrical-thermal-stress coupled field modeling 閱讀全文 »
Effect of hydrophilicity of carbon nanotube arrays on the release rate and activity of recombinant human bone morphogenetic protein-2 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of hydrophilicity of carbon nanotube arrays on the release rate and activity of recombinant human bone morphogenetic protein-2 閱讀全文 »
Electrical-thermal-stress coupled-field effect in SOI and partial SOI lateral power diode 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electrical-thermal-stress coupled-field effect in SOI and partial SOI lateral power diode 閱讀全文 »
Covalent functionalization of carbon nanotubes and their use in dielectric epoxy composites to improve heat dissipation 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Covalent functionalization of carbon nanotubes and their use in dielectric epoxy composites to improve heat dissipation 閱讀全文 »
Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 閱讀全文 »
Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy 閱讀全文 »
FTIR spectroscopy as a tool for nano-material characterization 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming FTIR spectroscopy as a tool for nano-material characterization 閱讀全文 »
Humidity study of a-Si PV cell 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Humidity study of a-Si PV cell 閱讀全文 »
Circuit level interconnect reliability study using 3D circuit model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Circuit level interconnect reliability study using 3D circuit model 閱讀全文 »
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 閱讀全文 »
