Novel rapid nondestructive technique for locating tiny voids in metallization line 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Novel rapid nondestructive technique for locating tiny voids in metallization line 閱讀全文 »
Diffusion studies of Cu in Si and low-k dielectric materials 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Diffusion studies of Cu in Si and low-k dielectric materials 閱讀全文 »
Reliability Data Analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability Data Analysis 閱讀全文 »
QFD implementation in a discrete semiconductor industry 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming QFD implementation in a discrete semiconductor industry 閱讀全文 »
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 閱讀全文 »
Analysis of electromigration test data 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Analysis of electromigration test data 閱讀全文 »
Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures 閱讀全文 »
Metastability in tritiated amorphous silicon 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Metastability in tritiated amorphous silicon 閱讀全文 »
Backside copper contamination issues in CMOS integrated circuits 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Backside copper contamination issues in CMOS integrated circuits 閱讀全文 »
Reliability data analysis software development 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability data analysis software development 閱讀全文 »
