Maintenance policy for predictive maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Maintenance policy for predictive maintenance (invited) 閱讀全文 »
Stress migration reliability of wide Cu interconnects with Gouging Vias 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Stress migration reliability of wide Cu interconnects with Gouging Vias 閱讀全文 »
Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) 閱讀全文 »
Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 閱讀全文 »
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 閱讀全文 »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 閱讀全文 »
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 閱讀全文 »
Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 閱讀全文 »
Examine the impact of maintenance policy for predictive maintenance 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Examine the impact of maintenance policy for predictive maintenance 閱讀全文 »
New analysis technique for time to failure data in copper electromigration 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming New analysis technique for time to failure data in copper electromigration 閱讀全文 »
