Indentation size effect on the creep behavior of a Sn-Ag-Cu solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the creep behavior of a Sn-Ag-Cu solder 閱讀全文 »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 閱讀全文 »
Indentation size effect on the hardness of a Sn-Ag-Cu Solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the hardness of a Sn-Ag-Cu Solder 閱讀全文 »
Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes 閱讀全文 »
Requirement for accurate interconnect temperature measurement for Electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Requirement for accurate interconnect temperature measurement for Electromigration test 閱讀全文 »
Going green for discrete power diode manufacturing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Going green for discrete power diode manufacturing 閱讀全文 »
Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth 閱讀全文 »
Comparative study of non-standard power diodes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Comparative study of non-standard power diodes 閱讀全文 »
Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder 閱讀全文 »
Transient electrical thermal analysis of ESD process using 3-D finite element method 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Transient electrical thermal analysis of ESD process using 3-D finite element method 閱讀全文 »
