A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry 閱讀全文 »
A cost model for the predictive maintenance policy of a multi-state system 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A cost model for the predictive maintenance policy of a multi-state system 閱讀全文 »
Predictive maintenance and its impact to business decision (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Predictive maintenance and its impact to business decision (invited) 閱讀全文 »
Maintenance policy for predictive maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Maintenance policy for predictive maintenance (invited) 閱讀全文 »
Stress migration reliability of wide Cu interconnects with Gouging Vias 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Stress migration reliability of wide Cu interconnects with Gouging Vias 閱讀全文 »
Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited) 閱讀全文 »
Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 閱讀全文 »
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 閱讀全文 »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 閱讀全文 »
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 閱讀全文 »
