Building empirical model through simulation a case study 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Building empirical model through simulation a case study 閱讀全文 »
Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer 閱讀全文 »
Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) 閱讀全文 »
Application of FMEA for build-in reliability and maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Application of FMEA for build-in reliability and maintenance (invited) 閱讀全文 »
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 閱讀全文 »
Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 閱讀全文 »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 閱讀全文 »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Investigation of the physical processes during electromigration of ULSI interconnection (invited) 閱讀全文 »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 閱讀全文 »
Overcoming intrinsic weakness of ULSI metallization on electromigration performances 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Overcoming intrinsic weakness of ULSI metallization on electromigration performances 閱讀全文 »
