Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 閱讀全文 »
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 閱讀全文 »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 閱讀全文 »
Effect of medium vacuum on low temperature wafer bonding 期刊 Journal Paper Effect of medium vacuum on low temperature wafer bonding 閱讀全文 »
Mechanism of sol-gel intermediate layer low temperature wafer bonding 期刊 Journal Paper Mechanism of sol-gel intermediate layer low temperature wafer bonding 閱讀全文 »
Study of carbon in thermal oxide formed on 4H-SiC by XPS 期刊 Journal Paper Study of carbon in thermal oxide formed on 4H-SiC by XPS 閱讀全文 »
Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc 閱讀全文 »
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 閱讀全文 »
Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 閱讀全文 »
Examine the impact of maintenance policy for predictive maintenance 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Examine the impact of maintenance policy for predictive maintenance 閱讀全文 »
