Finite element modeling of capacitive coupling voltage contrast 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of capacitive coupling voltage contrast 閱讀全文 »
Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data 閱讀全文 »
Room temperature observation of point defect on gold surface using thermovoltage mapping 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Room temperature observation of point defect on gold surface using thermovoltage mapping 閱讀全文 »
Statistical analysis of multi-censored electromigration data using the EM algorithm 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Statistical analysis of multi-censored electromigration data using the EM algorithm 閱讀全文 »
An approach to statistical analysis of gate oxide breakdown mechanisms 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming An approach to statistical analysis of gate oxide breakdown mechanisms 閱讀全文 »
Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling 閱讀全文 »
Development of highly accelerated electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Development of highly accelerated electromigration test 閱讀全文 »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 閱讀全文 »
Electromigration in damascene copper interconnects of line width down to 100 nm 期刊 Journal Paper Electromigration in damascene copper interconnects of line width down to 100 nm 閱讀全文 »
Development of highly accelerated electromigration test 期刊 Journal Paper Development of highly accelerated electromigration test 閱讀全文 »
