Electromigration in ULSI Interconnects 期刊 Journal Paper Electromigration in ULSI Interconnects 閱讀全文 »
Application of Gamma Distribution in Electromigration for Submicron Interconnects 期刊 Journal Paper Application of Gamma Distribution in Electromigration for Submicron Interconnects 閱讀全文 »
Lifetime modeling for stress-induced voiding in integrated circuit interconnections 期刊 Journal Paper Lifetime modeling for stress-induced voiding in integrated circuit interconnections 閱讀全文 »
Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab 期刊 Journal Paper Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab 閱讀全文 »
Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling 期刊 Journal Paper Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling 閱讀全文 »
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure 期刊 Journal Paper Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure 閱讀全文 »
Feasibility study of the application of voltage contrast to printed circuit board 期刊 Journal Paper Feasibility study of the application of voltage contrast to printed circuit board 閱讀全文 »
Low temperature sol-gel intermediate layer wafer bonding 期刊 Journal Paper Low temperature sol-gel intermediate layer wafer bonding 閱讀全文 »
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 期刊 Journal Paper Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 閱讀全文 »
