跳至主要內容
可靠度科學技術研究中心 CREST, Chang Gung University
搜尋
  • 首頁
  • 中心簡介
    • 主任介紹 Director
    • 主任的話 Message
    • 中心願景 Vision&Mission
    • 可靠度學程 Program
    • 獲獎 Awards
    • 組織架構 Organization
  • CReST談話
    • 中心季刊 Newsletter
    • 影像集 Album
  • 研究群
  • 實驗室核心
    • 設備 Equipment
    • 軟體 Software
    • 合作 Cooperation
  • 研究成果
  • 刊物
    • 著作 Book
    • 著作章節 Book chapters
    • 期刊 Journal Paper
    • 會議論文 Conference Paper
  • 聯絡
  • 網站導覽
  • 長庚大學
  • English
  • 中文 (台灣)
  • 長庚大學
    • English
    可靠度科學技術研究中心 CREST, Chang Gung University
    • 首頁
    • 中心簡介
      • 主任介紹 Director
      • 主任的話 Message
      • 中心願景 Vision&Mission
      • 可靠度學程 Program
      • 獲獎 Awards
      • 組織架構 Organization
    • CReST談話
      • 中心季刊 Newsletter
      • 影像集 Album
    • 研究群
    • 實驗室核心
      • 設備 Equipment
      • 軟體 Software
      • 合作 Cooperation
    • 研究成果
    • 刊物
      • 著作 Book
      • 著作章節 Book chapters
      • 期刊 Journal Paper
      • 會議論文 Conference Paper
    • 聯絡
    • 網站導覽
    • 長庚大學
    • English
    • 中文 (台灣)
  • 長庚大學
    • English
    可靠度科學技術研究中心 CREST, Chang Gung University > Articles by: a0938724577

    a0938724577

    Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites 閱讀全文 »

    Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects 閱讀全文 »

    Electromigration in width transition copper interconnect

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Electromigration in width transition copper interconnect 閱讀全文 »

    Very high current density package level electromigration test for copper interconnects

    期刊 Journal Paper

    Very high current density package level electromigration test for copper interconnects 閱讀全文 »

    A bimodal 3-parameter lognormal mixture distribution for electromigration failures

    期刊 Journal Paper

    A bimodal 3-parameter lognormal mixture distribution for electromigration failures 閱讀全文 »

    Finite element modeling of capacitive coupling voltage contrast

    期刊 Journal Paper

    Finite element modeling of capacitive coupling voltage contrast 閱讀全文 »

    An approach to statistical analysis of gate oxide breakdown mechanisms

    期刊 Journal Paper

    An approach to statistical analysis of gate oxide breakdown mechanisms 閱讀全文 »

    Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures

    期刊 Journal Paper

    Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures 閱讀全文 »

    Aligned carbon nanotubes for through-wafer interconnects

    期刊 Journal Paper

    Aligned carbon nanotubes for through-wafer interconnects 閱讀全文 »

    Room temperature observation of point defect on gold surface using thermovoltage mapping

    期刊 Journal Paper

    Room temperature observation of point defect on gold surface using thermovoltage mapping 閱讀全文 »

    ← Previous 1 ... 7 8 9 ... 13 Next →
    • 中心公告
    • 刊物 Publication
      • 著作 Book
      • 會議論文 Conference Paper
        • 陳始明 Dr. Tan, Cher Ming
        • 高瑄苓 Dr. Kao,Hsuan-Ling
        • 李坤穆 Dr. Kun-Mu Lee
        • 陳効謙 Dr. Hsiao-Chien Chen
      • 期刊 Journal Paper
        • 陳始明 Dr. Tan, Cher Ming
        • 高瑄苓 Dr. Kao,Hsuan-Ling
        • 李坤穆 Dr. Kun-Mu Lee
        • 趙自強 Dr. Chao TC
        • 陳効謙 Dr. Hsiao-Chien Chen
      • 著作章節 Book chapters
    • 中心季刊 Newsletter
    • 影像集 Album

    近期文章 Recent Posts

    • Newsletter No.9 Jul. 2025
    • 恭賀陳始明教授連續5年榮獲「全球前2%頂尖科學家榜單」殊榮
    • Newsletter No.8 Mar.2024
    • 影片導覽 Video
    • 2023.09.05 臺灣可靠度協會籌備會

    標籤 Tags

    Battery (15) Devices Reliability (27) Electromagnetics (10) Failure Analysis (16) General Reliability (3) Integrated Circuit Reliability (13) Interconnects Reliability (80) LED Reliability (36) Memory (1) Nanotechnology (46) Others (32) Predictive Maintenance (3) Predictive Maintenance/ Prognosis and Health Mgt (7) Prognosis and Health Mgt (16) Quality (8) Quantitative Service Reliability Assessment on Single and Multi Layer Networks (5) Radiation (7) Reliability Statistics (12) Remanufacturing (2) Theory and Practice of Quality and Reliability Engineering in Asia Industry (2) Wafer Bonding (19)

    333323桃園市龜山區文化一路259號第二醫學大樓4樓
    4th Floor, 2nd Medical Science Building, No.259, Wenhua 1st Rd., Guishan Dist., Taoyuan City 33302, Taiwan (R.O.C.)
    TEL:886-3-2118800 ext 3872
    E-Mail:crest@mail.cgu.edu.tw
    網站內容為長庚大學可靠度科學技術研究中心所有,未經允許請勿轉載
    Copyright ©Center for Reliability Sciences & Technologies, Chang Gung University

    • FB
    • Linkedin