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    可靠度科學技術研究中心 CREST, Chang Gung University
    • 首頁
    • 中心簡介
      • 主任介紹 Director
      • 主任的話 Message
      • 中心願景 Vision&Mission
      • 可靠度學程 Program
      • 獲獎 Awards
      • 組織架構 Organization
    • CReST談話
      • 中心季刊 Newsletter
      • 影像集 Album
    • 研究群
    • 實驗室核心
      • 設備 Equipment
      • 軟體 Software
      • 合作 Cooperation
    • 研究成果
    • 刊物
      • 著作 Book
      • 著作章節 Book chapters
      • 期刊 Journal Paper
      • 會議論文 Conference Paper
    • 聯絡
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    • 長庚大學
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  • 長庚大學
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    可靠度科學技術研究中心 CREST, Chang Gung University > Articles by: a0938724577

    a0938724577

    Modeling and analysis of gate-all-around silicon nanowire FET

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Modeling and analysis of gate-all-around silicon nanowire FET 閱讀全文 »

    A practical framework of electrical based online state-of-charge estimation of lithium ion batteries

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    A practical framework of electrical based online state-of-charge estimation of lithium ion batteries 閱讀全文 »

    Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions 閱讀全文 »

    Damage Threshold Determination and Non-destructive Identification of Possible Failure Sites in PIN Limiter

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Damage Threshold Determination and Non-destructive Identification of Possible Failure Sites in PIN Limiter 閱讀全文 »

    Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for high yield etching process

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for high yield etching process 閱讀全文 »

    Degradation mechanisms in gate-all-around silicon Nanowire field effect transistor under electrostatic discharge stress – a modeling approach

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Degradation mechanisms in gate-all-around silicon Nanowire field effect transistor under electrostatic discharge stress – a modeling approach 閱讀全文 »

    Rapid ULSI Interconnect Reliability Analysis Using Neural Networks

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Rapid ULSI Interconnect Reliability Analysis Using Neural Networks 閱讀全文 »

    ffects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for high power light-emitting diode in switching applications

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    ffects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for high power light-emitting diode in switching applications 閱讀全文 »

    Systematic root cause analysis for GaP green light LED degradation

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Systematic root cause analysis for GaP green light LED degradation 閱讀全文 »

    Optimal maintenance strategy of deteriorating system under imperfect maintenance & inspection using mixed inspection scheduling

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Optimal maintenance strategy of deteriorating system under imperfect maintenance & inspection using mixed inspection scheduling 閱讀全文 »

    ← Previous 1 ... 3 4 5 ... 13 Next →
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        • 陳始明 Dr. Tan, Cher Ming
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        • 陳効謙 Dr. Hsiao-Chien Chen
      • 期刊 Journal Paper
        • 陳始明 Dr. Tan, Cher Ming
        • 高瑄苓 Dr. Kao,Hsuan-Ling
        • 李坤穆 Dr. Kun-Mu Lee
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    標籤 Tags

    Battery (15) Devices Reliability (27) Electromagnetics (10) Failure Analysis (16) General Reliability (3) Integrated Circuit Reliability (13) Interconnects Reliability (80) LED Reliability (36) Memory (1) Nanotechnology (46) Others (32) Predictive Maintenance (3) Predictive Maintenance/ Prognosis and Health Mgt (7) Prognosis and Health Mgt (16) Quality (8) Quantitative Service Reliability Assessment on Single and Multi Layer Networks (5) Radiation (7) Reliability Statistics (12) Remanufacturing (2) Theory and Practice of Quality and Reliability Engineering in Asia Industry (2) Wafer Bonding (19)

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