Overcoming intrinsic weakness of ULSI metallization electromigration performances 期刊 Journal Paper Overcoming intrinsic weakness of ULSI metallization electromigration performances 閱讀全文 »
Non-destructive void size determination in copper metallization under passivation 期刊 Journal Paper Non-destructive void size determination in copper metallization under passivation 閱讀全文 »
Temperature and stress distribution in the SOI structure during fabrication 期刊 Journal Paper Temperature and stress distribution in the SOI structure during fabrication 閱讀全文 »
A new method for deposition of cubic Ta diffusion barrier for Cu metallization 期刊 Journal Paper A new method for deposition of cubic Ta diffusion barrier for Cu metallization 閱讀全文 »
Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 期刊 Journal Paper Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 閱讀全文 »
Metastability in tritiated amorphous silicon 期刊 Journal Paper Metastability in tritiated amorphous silicon 閱讀全文 »
Application of wigner-ville distribution in electromigration noise analysis 期刊 Journal Paper Application of wigner-ville distribution in electromigration noise analysis 閱讀全文 »
A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) 期刊 Journal Paper A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) 閱讀全文 »
Using power diode models for circuit simulations – a comprehensive review 期刊 Journal Paper Using power diode models for circuit simulations – a comprehensive review 閱讀全文 »
Effect of BOE etching time on wire bonding qualit 期刊 Journal Paper Effect of BOE etching time on wire bonding qualit 閱讀全文 »
