期刊 Journal Paper Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification Bya0938724577 2006 年 2 月 25 日
期刊 Journal Paper Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Bya0938724577 2006 年 2 月 25 日2021 年 3 月 4 日
期刊 Journal Paper Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects Bya0938724577 2006 年 2 月 25 日2021 年 3 月 4 日
期刊 Journal Paper Investigation of weight-on-wheel switch failure in F-16 aircraft Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Mathematical model for low-temperature wafer bonding under medium vacuum and its application Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Reliability screening through electrical testing for press-fit alternator power diode in automotive application Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Temperature dependence of the field emission of multiwalled carbon nanotubes Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects Bya0938724577 2005 年 2 月 25 日
