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    可靠度科學技術研究中心 CREST, Chang Gung University
    • 首頁
    • 中心簡介
      • 主任介紹 Director
      • 主任的話 Message
      • 中心願景 Vision&Mission
      • 可靠度學程 Program
      • 獲獎 Awards
      • 組織架構 Organization
    • CReST談話
      • 中心季刊 Newsletter
      • 影像集 Album
    • 研究群
    • 實驗室核心
      • 設備 Equipment
      • 軟體 Software
      • 合作 Cooperation
    • 研究成果
    • 刊物
      • 著作 Book
      • 著作章節 Book chapters
      • 期刊 Journal Paper
      • 會議論文 Conference Paper
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    可靠度科學技術研究中心 CREST, Chang Gung University > Articles by: a0938724577

    a0938724577

    Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification

    期刊 Journal Paper

    Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification 閱讀全文 »

    Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect

    期刊 Journal Paper

    Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 閱讀全文 »

    Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects

    期刊 Journal Paper

    Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 閱讀全文 »

    Investigation of weight-on-wheel switch failure in F-16 aircraft

    期刊 Journal Paper

    Investigation of weight-on-wheel switch failure in F-16 aircraft 閱讀全文 »

    Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist

    期刊 Journal Paper

    Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »

    Mathematical model for low-temperature wafer bonding under medium vacuum and its application

    期刊 Journal Paper

    Mathematical model for low-temperature wafer bonding under medium vacuum and its application 閱讀全文 »

    Reliability screening through electrical testing for press-fit alternator power diode in automotive application

    期刊 Journal Paper

    Reliability screening through electrical testing for press-fit alternator power diode in automotive application 閱讀全文 »

    Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications

    期刊 Journal Paper

    Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 閱讀全文 »

    Temperature dependence of the field emission of multiwalled carbon nanotubes

    期刊 Journal Paper

    Temperature dependence of the field emission of multiwalled carbon nanotubes 閱讀全文 »

    Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects

    期刊 Journal Paper

    Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects 閱讀全文 »

    ← Previous 1 ... 9 10 11 ... 13 Next →
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        • 陳始明 Dr. Tan, Cher Ming
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        • 陳始明 Dr. Tan, Cher Ming
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    標籤 Tags

    Battery (15) Devices Reliability (27) Electromagnetics (10) Failure Analysis (16) General Reliability (3) Integrated Circuit Reliability (13) Interconnects Reliability (80) LED Reliability (36) Memory (1) Nanotechnology (46) Others (32) Predictive Maintenance (3) Predictive Maintenance/ Prognosis and Health Mgt (7) Prognosis and Health Mgt (16) Quality (8) Quantitative Service Reliability Assessment on Single and Multi Layer Networks (5) Radiation (7) Reliability Statistics (12) Remanufacturing (2) Theory and Practice of Quality and Reliability Engineering in Asia Industry (2) Wafer Bonding (19)

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