Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing 閱讀全文 »
Reliabiilty Analysis and Application with MATLAB (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliabiilty Analysis and Application with MATLAB (invited) 閱讀全文 »
Low temperature wafer bonding in medium vacuum 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature wafer bonding in medium vacuum 閱讀全文 »
Building empirical model through simulation a case study 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Building empirical model through simulation a case study 閱讀全文 »
Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer 閱讀全文 »
Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited) 閱讀全文 »
Application of FMEA for build-in reliability and maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Application of FMEA for build-in reliability and maintenance (invited) 閱讀全文 »
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 閱讀全文 »
Non-destructive void size determination in copper metallization under passivation 期刊 Journal Paper Non-destructive void size determination in copper metallization under passivation 閱讀全文 »
Temperature and stress distribution in the SOI structure during fabrication 期刊 Journal Paper Temperature and stress distribution in the SOI structure during fabrication 閱讀全文 »
