研究項目
Research Project
講座/演講/教程 Keynote/Invited/Tutorials
專利
Patent

Tutorials

  1. C. M. Tan and Y. Liu. “Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system (Tutorial),” in IEEE Int. Electronic Packaging and Technology Conf., 2008.
  2. C. M. Tan. “Physics of electromigration in today ULSI interconnections (Tutorial),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.
  3. Cher Ming Tan, “Statistical Analysis of Reliability Test Data”, one day workshop– Characterization, Modeling and Reliability Issues on Nano Materials and Devices, Chennai, India, 2nd March, 2016.
  4. Cher Ming Tan, “Introduction to Reliability (Tutorial),” in IEEE 23rd International Symposium on the Physical and Failure Analysis of Intergrated Circuits, Marina Bay Sands, Singapore, 18-21 July, 2016.
  5. Cher Ming Tan, “Statistical Analysis of Reliability Test Data (Tutorial),” in 2016 Taiwan ESD and Reliability Conference (TESDC-2016), Hsin Chu, Taiwan, Oct. 31-Nov. 2, 2016.
  6. Cher Ming Tan, “Applications of finite element modeling in Reliability Studies (Tutorial)”, in 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017), Cheng Du, China, 4-7 July, 2017.
  7. Cher Ming Tan, “Failure Analysis in Semiconductor Package Assembly”, in Electronic Packaging Convention (EPCON), Penang, Malaysia, 7th-9th August 2018.
  8. Cher Ming Tan, “Degradation Physics for LED and PCB” IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022), Marina Bay Sands, Singapore, July 18-22, 2022