Mapping of solder mask covered interconnects on high density printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Mapping of solder mask covered interconnects on high density printed circuit board 閱讀全文 »
Device level electrical-thermal-stress coupled-field modeling 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Device level electrical-thermal-stress coupled-field modeling 閱讀全文 »
A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs 閱讀全文 »
A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry 閱讀全文 »
A cost model for the predictive maintenance policy of a multi-state system 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A cost model for the predictive maintenance policy of a multi-state system 閱讀全文 »
Predictive maintenance and its impact to business decision (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Predictive maintenance and its impact to business decision (invited) 閱讀全文 »
Maintenance policy for predictive maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Maintenance policy for predictive maintenance (invited) 閱讀全文 »
Investigation of weight-on-wheel switch failure in F-16 aircraft 期刊 Journal Paper Investigation of weight-on-wheel switch failure in F-16 aircraft 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 期刊 Journal Paper Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
Mathematical model for low-temperature wafer bonding under medium vacuum and its application 期刊 Journal Paper Mathematical model for low-temperature wafer bonding under medium vacuum and its application 閱讀全文 »
